Semiconductors
Physical Design and Signoff
We harness the industry’s most advanced physical design tools and techniques to deliver optimal results for your complex chip designs.
Achieving timing closure is crucial for high-speed chip designs. Our engineers utilize cutting-edge tools and methodologies to analyze and optimize your design for timing, ensuring it meets or exceeds your performance specifications.
At AstraSilica, we understand that the journey from a brilliant chip design concept to a fully realized, market-ready product requires meticulous planning, expert execution, and rigorous signoff processes. Our physical design and signoff services bridge the gap between design and manufacturing, ensuring your vision translates seamlessly into silicon.
Our team of experienced physical design engineers are masters of navigating the complexities of deep submicron technologies. We leverage industry-leading tools and methodologies to deliver optimized layouts that meet your performance, power, area, and cost targets.
We work closely with you throughout the entire process, providing regular updates, design reviews, and transparent communication. Our goal is to deliver a fully optimized, signoff-ready design package that empowers you to move confidently into manufacturing.
Synthesis
- Setting up the Synthesis Flow
- Developing Constraints
- Logic and Physical Aware Synthesis Using Industry Standard Tools
Logic Equivalence Check (LEC)
- Setting up the LEC flow for both Functional and CLP
- Block Level and Top Level LEC Runs
- Analysis & Debug skills for Complex Issues
Physical Design (RTL - GDSII)
- RTL Synthesis (Logical & Physical aware)
- Design For test (Scan, MBIST, ATPG)
- Library Quality Checks, IP Validation
- Die Size Estimation (Bump and Ball requirement, MFU)
- IO Planning, Floor Planning, Partitioning
- Power Planning and Low Power Strategy
- Place & Route
- Clock Tree Synthesis
- Design for Manufacture (Metal Fill, Spare Cells, Decap Cells)
- Power Analysis (EM/IR)
- Physical Verification (DRC, LVS, ERC, ANTENNA, PERC, XOR)
- Low Power Checks (CLP) & Formality (LEC)
- Full Chip/Partition Timing Closure, MMMC Signoff
- ECO Iteration (Functional & Timing Fixes)
Static Timing Analysis (STA)
- Setting up the STA flow
- Develop Timing Constraints for Multiple Modes
- Timing Analysis for Multi Modes & Multi Corners
- Timing ECOs using TSO or DMSA
- SI Analysis
